
Description
Jack, Phone; 3; Brass; Ni/Au; 0.768 in.; 0.985 in.
- Insulation material is thermoplastic
- Operating temperature is -25 °C to +70 °C
- 500 Vrms
| Electrical | |
| Contact resistance | < 10 mΩ |
| Dielectric strength | 0,5 kVdc |
| Rated current per contact | 1 A |
| Mechanical | |
| Insertion force | ≤ 20 N |
| Withdrawal force | > 10 N |
| Lifetime | 5000 mating cycles |
| Panel thickness | 4 mm |
| Material | |
| Contact plating | SnCe |
| Contacts | CuSn6 |
| Insert | insulation board |
| Shell | CuZn39Pb3 gal 2 m Ni plated |
| Environmental | |
| Solderability | Complies with IEC 68-2-20 |
| Temperature range | -20 ¡C to +70 ¡C |
Jack, Phone; 3; Brass; Ni/Au; 0.768 in.; 0.985 in.
- Insulation material is thermoplastic
- Operating temperature is -25 °C to +70 °C
- 500 Vrms
| Electrical | |
| Contact resistance | < 10 mΩ |
| Dielectric strength | 0,5 kVdc |
| Rated current per contact | 1 A |
| Mechanical | |
| Insertion force | ≤ 20 N |
| Withdrawal force | > 10 N |
| Lifetime | 5000 mating cycles |
| Panel thickness | 4 mm |
| Material | |
| Contact plating | SnCe |
| Contacts | CuSn6 |
| Insert | insulation board |
| Shell | CuZn39Pb3 gal 2 m Ni plated |
| Environmental | |
| Solderability | Complies with IEC 68-2-20 |
| Temperature range | -20 ¡C to +70 ¡C |
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